Automatic wafer cleaning machine 
 Automatic wafer cleaning equipment Description: Model: CGB-XX-X series, Brand: Hua Linjia industry-CGB 1) for monocrystalline silicon grinding, cutting volume after cleaning wafers after slicing lines show mass cleaning. 2) Process: DI water + nitrogen bubbling ultrasonic spray → → → → spray alkaline ultrasonic overflow 3) equipment used linkage manipulator with a basket by the beat while moving, the process time to adjust itself 4) under the standard production process: silicon 1000 / hour. There is a demand of equipment in this regard, welcome to inquire: http://www.cgbchn.com 010-58467689 \ 010-58467685 \ 13910297918 / Geng Biao. The Company Law Advisory Group solemnly declare: According to the law, within the PRC, Beijing Hualin Jia Technology Co., Ltd. is the only relevant "Hualin Jia industry" the words and names such as the legality of the exclusive right to the company, any individual agencies may not use.